Key Responsibilities:
1. Structural Design & New Product Development (NPD)
• Functional Design: Ensure designs include proper dust flaps, tuck-ins, and locking mechanisms that function perfectly on manual or automated filling lines.
• Material Selection: Advise on the appropriate board grade and thickness (GSM/Microns) based on the weight and fragility of the customer’s product.
2. Prototyping & Sample Making
• Physical Sampling: Operate the digital plotting table/sample maker to produce high-precision prototypes for client testing and "fit" approval.
• Fit Testing: Conduct "Drop Tests" or "Fit Tests" by placing the actual product inside the sample to ensure zero movement and maximum protection.
• Revision Management: Adjust structural dimensions based on client feedback or production constraints.
3. Technical Die-line Production
• Manufacturing Blueprints: Create final technical die-lines (including cut, crease, perforation, and partial cut lines) that serve as the master template for the Graphic designers and Die-makers.
• Nicks & Stripping: Specify the location of nicks and stripping points to assist the Die-Cutting department in efficient production.
• Embossing/Debossing: Design specific layers for special finishes like foil stamping or embossing to ensure they align perfectly with the structure.
4. Estimation & Cost Optimization (Reel/Sheet Analysis)
• Nesting & Imposition: Strategically arrange (nest) the designs on a sheet or reel to achieve the highest possible material yield and minimize "scrap" or waste.
• Costing Support: Perform detailed material analysis to provide the sales and procurement teams with accurate board consumption and costing data.
Technical Competencies
• Software Expertise: Mastery of packaging-specific CAD software (e.g., ArtiosCAD, Impact, or AutoCAD).
• Geometry & Precision: Exceptional mathematical skills with the ability to work within tolerances of ?0.1mm.
• Material Science: Deep understanding of paperboard grain direction and how it affects folding and strength.
Key Performance Indicators (KPIs)
• Material Yield: Percentage of the board utilized vs. wasted (aiming for maximum efficiency).
• Fit Accuracy: Percentage of samples that fit the customer's product on the first attempt.
• Die Accuracy: Zero errors in the final die-lines that lead to incorrect tool manufacturing.
• Sample Turnaround: Time taken from a design brief to a physical sample in hand.
If interested, you can apply by sharing your CV in the email address given below, mentioning the job titles applying for in the emails subject.
[email protected]