MediaTek Data Center Solutions — Custom ASIC & XPU Design For AI Infrastructure

MediaTek offers end-to-end AI data center solutions built for the demands of hyperscale computing. Specializing in custom ASIC design and custom XPUs, MediaTek helps hyperscalers, cloud service providers, and AI platform companies architect compute systems tailored to their exact workloads — from logic die design and advanced 2.5D/3.5D packaging to high-bandwidth memory (HBM) integration and full-stack interconnects.

With deep expertise in early adoption of advanced process nodes (N3, N2, A14) and Design-Technology Co-Optimization (DTCO), MediaTek delivers chips optimized for performance-per-watt and performance-per-TCO — the metrics that matter most in modern AI compute. The company's interconnect portfolio spans on-package die-to-die links (UCIe, MLink), chip-to-chip connections (SerDes/PCIe), and long-reach solutions including co-packaged optics (CPO) — all engineered for rack-level and data-center-scale efficiency.

MediaTek's strategic partnerships, including NVIDIA NVLink Fusion integration and joint Active Optical Cable research with Microsoft, position it as a trusted partner for companies building next-generation, gigawatt-scale AI infrastructure.

Ideal for: Hyperscalers, cloud service providers, AI infrastructure companies, and enterprises exploring custom silicon solutions for AI training and inference at scale.

Learn more / Contact: https://www.mediatek.com/pr ...